TLM-510(D)
Halogen Free Low Dk/Df Prepreg and Laminate TLM-510(D) products are Halogen free materials manufactured with a unique high performance epoxy resin reinforced with electrical grade (E-glass) glass fabric and provide the low dielectric constant (Dk) and low dissipation factor (Df) demanded by high speed, low loss Printed Wiring Board (PWB) designs and applications.
TLM-510(D) offers enhanced thermal resistance due to a high Tg value with lower z-CTE Value and designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. These materials are compatible with Lead free process and exhibit the UV block characteristic and also exhibit superior chemical resistance, thermal stability and CAF-resistance.
Performance and Processing Advantages
1. Improved Dielectric properties
- Dk ~ 3.9 and Df ~ 0.014 (1 GHz)
2. High performance epoxy blend which yield a higher heat resistance
3. Superior dielectric thickness control
4. Enhanced thermal and chemical resistance
5. Compatible with automatic optical inspection process
6. UV-block feature
7. Lead free solder process compatible
8. CAF-Resistance capability
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TLM-170(LD)
Low Dk/Df Prepreg and Laminate TLM-170(LD) products are manufactured with a unique high performance resin reinforced with electrical grade glass fabric and provide the low dielectric constant (Dk) and low dissipation factor (Df) demanded by high speed, low loss Printed Wiring Board (PWB) designs and applications.
TLM-170(LD) offers enhanced thermal resistance due to a high Tg value, lower z-CTE Value and achieve flammability calss of UL94 V-0. These materials are compatible with Lead free process and also exhibit superior chemical resistance, thermal stability and CAF-resistance.
Performance and Processing Advantages
1. Improved Dielectric properties
- Dk < 3.8 and Df < 0.0075 (10 GHz)
2. Excellent electrical performance
3. Superior dielectric thickness control
4. Enhanced thermal and chemical resistance
5. Compatible with automatic optical inspection process
6. Lead free solder process compatible
7. CAF-Resistance capability
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